Thermal Interface Materials

Thermally conductive gap fillers

Thermal conductive gap fillers are available in two categories: silicone-based and non-silicone-based. They are usually two-component and can be cured at room temperature. They have certain impact resistance and stress relief properties and are used to fill gaps in electronic components. These materials are used in conjunction with heat sinks or metal housings to help promote heat dissipation of key electronic components. These non-adhesive curing adhesives can form a soft interface that absorbs stress and fills uneven areas, thereby improving cooling effects and are suitable for high-output assembly applications. After full curing, they have excellent thermal conductivity, corrosion resistance, insulation and other properties, and are mainly used for thermal conductivity of electronic devices and automotive power batteries.

Thermally conductive structural adhesives

Thermal conductive structural adhesives are a type of adhesive that combines thermal conductivity and high-strength bonding. They are usually based on two-component polyurethane and epoxy resins and can be quickly cured at room temperature. The thermal conductivity and bonding properties of thermally conductive structural adhesives can be effectively adjusted by pre-treating the resin and filler, and optimizing the curing agent system. After the two components are mixed, this type of product will gradually form an adhesive layer with good mechanical properties at room temperature. After complete curing, this type of product has excellent bonding, corrosion resistance, insulation and other properties. It is mainly used for thermal bonding of automotive power batteries and has good bonding strength to substrates such as PET, PA, and aluminum.

Thermally conductive potting adhesive

Thermal conductive potting adhesive is a type of adhesive with low viscosity, high fluidity, can be cured at room temperature or quickly cured by heating, and has no solvents or curing by-products during the curing process. It can be used for thermal sealing protection of electronic components. After curing, it has excellent electrical insulation properties, can withstand environmental pollution, and avoid damage to electronic products caused by environmental factors such as stress, vibration, and humidity. It is especially suitable for products that require good heat dissipation of potting materials. This type of product can be used for thermal potting of motors and electronic components due to its excellent thermal conductivity, corrosion resistance, insulation and other properties.

Sealing adhesive

Adhesive is a type of product used for structural bonding to replace traditional mechanical locking. There are mainly two types: polyurethane and pressure-sensitive hot melt adhesive. Polyurethane structural adhesive is a two-component adhesive with moderate viscosity that can be quickly cured at room temperature. After being fully cured, this type of product has good toughness and exhibits good bonding, corrosion resistance, insulation and other properties under different environments. It is mainly used for bonding of automotive power battery packs and battery modules, and has good adhesion to plastic, aluminum, electrophoretic steel and other substrates. Pressure-sensitive hot melt adhesive is a semi-dry solid that is coated on the substrate when heated to a molten state and has permanent adhesion after cooling. This type has good peel strength and can provide good adhesion under high temperature conditions. Compared with ordinary hot melt pressure-sensitive adhesives, it can provide moderate thermal stability. It is mainly used for bonding of power battery soft pack battery modules, and has good adhesion to plastic, aluminum and other substrates.